Cited References: 39           Times Cited: 0

Abstract:
The effects of interstitial carbon on the electronic and: mechanical properties of copper are studied theoretically. Semiempirical methodology, atomistic simulations and first-principles density-functional embedded-cluster schemes are combined to extract some understanding of the diffusion: process and related degradation of Cu-C composite materials under extremes of temperature and stress. High-resolution scanning electron microscopy results are presented, which demonstrate the existence of a solid solution zone at the Cu-C interface.

KeyWords Plus:
EMBEDDED-CLUSTER MODEL, TSALLIS STATISTICS, BINARY-ALLOYS, OPTIMIZATION

Addresses:
Ellis DE, Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA.
Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA.
Northwestern Univ, Mat Res Ctr, Evanston, IL 60208 USA.
Ben Gurion Univ Negev, Dept Mat Engn, IL-84105 Beer Sheva, Israel.
Technion Israel Inst Technol, Dept Phys, IL-32000 Haifa, Israel.
Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel.

Publisher:  TAYLOR & FRANCIS LTD, LONDON
IDS Number:  242KQ
ISSN:  0141-8637